Chipbond Technology Corporation
6147.TWO
Price:
$52.9
Market Cap:
$39.39B
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, ...[Read more]
Industry
Semiconductors
IPO Date
2007-12-31
Stock Exchange
TWO
Ticker
6147.TWO
PE Ratio
[13.92]
ROE
[6.43%]
Current Ratio
[2.19]
Dividend Yield
[7.09%]
Enterprise Value
[33.69B]
Dividend History
6147.TWO Dividend History Overview
Dividends are a key part of long-term returns for investors, and Chipbond Technology Corporation (6147.TWO) has a track record worth reviewing. Looking at dividend history for 6147.TWO gives you an idea of how consistent the dividends have been and what you might expect in the future.
Ex-Dividend Date
2025-06-17
Dividend Yield
7.09%
Annual Dividend
$3.75
P/E Ratio
13.92
Payout Ratio
0
Dividend per Share
$3.75
EPS
3.80
| Ex-Date/EFF Date | Dividend Amount | Adjusted Dividend | Payment Date | Declaration Date |
|---|---|---|---|---|
| 2025-06-17 | $3.75021 | $3.75021 | 2025-07-15 | |
| 2024-05-23 | $3.75 | $3.75 | 2024-06-14 | |
| 2023-06-16 | $5.5 | $5.5 | 2023-07-14 | |
| 2022-07-20 | $6 | $6 | 2022-08-12 | |
| 2021-07-21 | $3.8 | $3.8 | 2021-08-13 | |
| 2020-07-23 | $4.2 | $4.2 | 2020-08-14 | |
| 2019-07-25 | $3.5 | $3.5 | 2019-08-19 | |
| 2018-07-25 | $2.35 | $2.35 | 2018-08-17 | |
| 2017-07-27 | $2.1 | $2.1 | 2017-08-18 | |
| 2016-07-28 | $2.1 | $2.1 | ||
| 2015-07-23 | $2.6 | $2.6 |
Chipbond Technology Corporation (6147.TWO) Dividend History Chart
The table below shows Chipbond Technology Corporation (6147.TWO) dividend history over the years, including the amount per share, the payout date, and any adjustments for stock splits.
Chipbond Technology Corporation (6147.TWO) Dividend Growth
Chipbond Technology Corporation (6147.TWO) dividend history also allows you to track its dividend growth over time. This gives you insight into how the company’s earnings and payout ratios have evolved. Tracking this growth can help you gauge the stock's potential for future income.
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Frequently asked questions❓
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