Chipbond Technology Corporation

Chipbond Technology Corporationverified

6147.TWO

Price:

$53.3

Market Cap:

$39.69B

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, ...[Read more]

Industry

Semiconductors

IPO Date

2007-12-31

Stock Exchange

TWO

Ticker

6147.TWO

The Enterprise Value as of December 2025 (TTM) for Chipbond Technology Corporation (6147.TWO) is 36.19B

According to Chipbond Technology Corporation’s latest financial reports and current stock price. The company's current Enterprise Value is 36.19B. This represents a change of -5.39% compared to the average of 38.25B of the last 4 quarters.

Chipbond Technology Corporation (6147.TWO) Historical Enterprise Value (quarterly & annually)

How has 6147.TWO Enterprise Value performed in the past?

The mean historical Enterprise Value of Chipbond Technology Corporation over the last ten years is 39.76B. The current 36.19B Enterprise Value has changed 9.00% with respect to the historical average. Over the past ten years (40 quarters), 6147.TWO's Enterprise Value was at its highest in in the March 2021 quarter at 52.71B. The Enterprise Value was at its lowest in in the June 2016 quarter at 27.55B.

Quarterly (TTM)
Annual

Average

39.76B

Median

39.68B

Minimum

29.38B

Maximum

49.07B

Chipbond Technology Corporation (6147.TWO) Enterprise Value by Quarter and Year

Discovering the peaks and valleys of Chipbond Technology Corporation Enterprise Value, unveiling quarterly and yearly fluctuations to gain insights into the company’s financial performance and market dynamics, offering valuable data for investors and analysts alike.

Maximum Annual Increase = 22.74%

Maximum Annual Enterprise Value = 49.07B

Minimum Annual Increase = -19.75%

Minimum Annual Enterprise Value = 29.38B

Quarterly (TTM)
Annual
YearEnterprise ValueChange
202439.38B-19.75%
202349.07B22.74%
202239.98B-12.72%
202145.81B4.65%
202043.77B6.00%
201941.29B7.55%
201838.39B8.24%
201735.47B20.73%
201629.38B-16.09%
201535.01B-16.58%

Chipbond Technology Corporation (6147.TWO) Average Enterprise Value

How has 6147.TWO Enterprise Value performed in the past?

The current Enterprise Value of Chipbond Technology Corporation (6147.TWO) is less than than its 3-year, less than than its 5-year, and less than than its 10-year historical averages

3-year avg

42.81B

5-year avg

43.60B

10-year avg

39.76B

Chipbond Technology Corporation (6147.TWO) Enterprise Value vs. Peers

How is 6147.TWO’s Enterprise Value compared to its peers?

Chipbond Technology Corporation’s Enterprise Value is less than Greatek Electronics Inc. (40.56B), greater than Xintec Inc. (33.97B), less than Ardentec Corporation (54.22B), less than Grand Process Technology Corporation (42.66B), greater than Foxsemicon Integrated Technology Inc. (30.59B), less than Faraday Technology Corporation (37.07B), greater than Arcadyan Technology Corporation (32.30B), less than Parade Technologies, Ltd. (38.15B), greater than ELAN Microelectronics Corporation (34.11B), less than Sigurd Microelectronics Corporation (51.82B),

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