6147.TWO
Price:
$52.9
Market Cap:
$39.39B
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, ...[Read more]
Industry
Semiconductors
IPO Date
2007-12-31
Stock Exchange
TWO
Ticker
6147.TWO
According to Chipbond Technology Corporation’s latest financial reports and current stock price. The company's current Dividend Yield is 7.09%. This represents a change of 303.78% compared to the average of 1.76% of the last 4 quarters.
The mean historical Dividend Yield of Chipbond Technology Corporation over the last ten years is 5.87%. The current 7.09% Dividend Yield has changed 20.76% with respect to the historical average. Over the past ten years (40 quarters), 6147.TWO's Dividend Yield was at its highest in in the September 2022 quarter at 11.88%. The Dividend Yield was at its lowest in in the December 2015 quarter at 0%.
Average
5.87%
Median
5.55%
Minimum
3.72%
Maximum
10.45%
Discovering the peaks and valleys of Chipbond Technology Corporation Dividend Yield, unveiling quarterly and yearly fluctuations to gain insights into the company’s financial performance and market dynamics, offering valuable data for investors and analysts alike.
Maximum Annual Increase = 86.34%
Maximum Annual Dividend Yield = 10.45%
Minimum Annual Increase = -27.20%
Minimum Annual Dividend Yield = 3.72%
| Year | Dividend Yield | Change |
|---|---|---|
| 2024 | 5.86% | -22.94% |
| 2023 | 7.61% | -27.20% |
| 2022 | 10.45% | 86.34% |
| 2021 | 5.61% | -11.48% |
| 2020 | 6.34% | 21.12% |
| 2019 | 5.23% | 36.87% |
| 2018 | 3.82% | 2.66% |
| 2017 | 3.72% | -18.53% |
| 2016 | 4.57% | -16.66% |
| 2015 | 5.48% | 21.74% |
The current Dividend Yield of Chipbond Technology Corporation (6147.TWO) is less than than its 3-year, less than than its 5-year, and less than than its 10-year historical averages
3-year avg
7.98%
5-year avg
7.17%
10-year avg
5.87%
Chipbond Technology Corporation’s Dividend Yield is less than Greatek Electronics Inc. (4.41%), less than Xintec Inc. (1.80%), less than Ardentec Corporation (4.48%), less than Grand Process Technology Corporation (1.61%), less than Foxsemicon Integrated Technology Inc. (4.85%), less than Faraday Technology Corporation (1.73%), less than Arcadyan Technology Corporation (4.10%), less than Parade Technologies, Ltd. (2.62%), less than ELAN Microelectronics Corporation (4.99%), less than Sigurd Microelectronics Corporation (4.43%),
| Company | Dividend Yield | Market cap |
|---|---|---|
| 4.41% | $38.74B | |
| 1.80% | $37.72B | |
| 4.48% | $42.27B | |
| 1.61% | $39.88B | |
| 4.85% | $32.16B | |
| 1.73% | $45.08B | |
| 4.10% | $40.32B | |
| 2.62% | $49.02B | |
| 4.99% | $36.79B | |
| 4.43% | $44.01B |
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