Chipbond Technology Corporation

Chipbond Technology Corporationverified

6147.TWO

Price:

$52.3

Market Cap:

$38.94B

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, ...[Read more]

Industry

Semiconductors

IPO Date

2007-12-31

Stock Exchange

TWO

Ticker

6147.TWO

The PE Ratio as of December 2025 (TTM) for Chipbond Technology Corporation (6147.TWO) is 13.76

According to Chipbond Technology Corporation’s latest financial reports and current stock price. The company's current PE Ratio is 13.76. This represents a change of -18.03% compared to the average of 16.79 of the last 4 quarters.

Chipbond Technology Corporation (6147.TWO) Historical PE Ratio (quarterly & annually)

How has 6147.TWO PE Ratio performed in the past?

The mean historical PE Ratio of Chipbond Technology Corporation over the last ten years is 11.67. The current 13.76 PE Ratio has changed 11.69% with respect to the historical average. Over the past ten years (40 quarters), 6147.TWO's PE Ratio was at its highest in in the March 2016 quarter at 41.90. The PE Ratio was at its lowest in in the September 2018 quarter at 3.64.

Quarterly (TTM)
Annual

Average

11.67

Median

11.68

Minimum

6.83

Maximum

16.25

Chipbond Technology Corporation (6147.TWO) PE Ratio by Quarter and Year

Discovering the peaks and valleys of Chipbond Technology Corporation PE Ratio, unveiling quarterly and yearly fluctuations to gain insights into the company’s financial performance and market dynamics, offering valuable data for investors and analysts alike.

Maximum Annual Increase = 95.69%

Maximum Annual PE Ratio = 16.25

Minimum Annual Increase = -45.16%

Minimum Annual PE Ratio = 6.83

Quarterly (TTM)
Annual
YearPE RatioChange
202411.52-13.82%
202313.3695.69%
20226.83-7.86%
20217.41-37.42%
202011.8410.67%
201910.7020.12%
20188.91-45.16%
201716.258.49%
201614.980.42%
201514.911.59%

Chipbond Technology Corporation (6147.TWO) Average PE Ratio

How has 6147.TWO PE Ratio performed in the past?

The current PE Ratio of Chipbond Technology Corporation (6147.TWO) is greater than its 3-year, greater than its 5-year, and greater than its 10-year historical averages

3-year avg

10.57

5-year avg

10.19

10-year avg

11.67

Chipbond Technology Corporation (6147.TWO) PE Ratio vs. Peers

How is 6147.TWO’s PE Ratio compared to its peers?

Chipbond Technology Corporation’s PE Ratio is less than Greatek Electronics Inc. (21.12), less than Xintec Inc. (27.79), less than Ardentec Corporation (19.74), less than Grand Process Technology Corporation (40.26), greater than Foxsemicon Integrated Technology Inc. (12.34), less than Faraday Technology Corporation (56.91), less than Arcadyan Technology Corporation (15.17), less than Parade Technologies, Ltd. (15.17), less than ELAN Microelectronics Corporation (15.55), less than Sigurd Microelectronics Corporation (17.36),

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