603325.SS
Price:
$77.77
Market Cap:
$6.22B
Shanghai Bloom Technology, Inc. engages in the provision of powder and granular material handling system solutions. Its services include pneumatic conveying, metering and mixing, storage, blending, and homogenization of materials and corresponding components, spare parts and services. The company was founded on November 19, 2001 and is headquartered in Shanghai, China.
Industry
Industrial - Machinery
IPO Date
2024-01-10
Stock Exchange
SHH
Ticker
603325.SS
Dividends are a key part of long-term returns for investors, and Shanghai Bloom Technology, Inc. (603325.SS) has a track record worth reviewing. Looking at dividend history for 603325.SS gives you an idea of how consistent the dividends have been and what you might expect in the future.
Ex-Dividend Date
2025-07-23
Dividend Yield
1.74%
Annual Dividend
$0.75
P/E Ratio
13.79
Payout Ratio
0.09
Dividend per Share
$1.35
EPS
5.64
| Ex-Date/EFF Date | Dividend Amount | Adjusted Dividend | Payment Date | Declaration Date |
|---|---|---|---|---|
| 2025-07-23 | $0.75 | $0.75 | 2025-07-23 | |
| 2025-01-23 | $0.72 | $0.6 | 2025-01-23 | |
| 2024-07-03 | $1.56 | $1.3 | 2024-07-03 |
The table below shows Shanghai Bloom Technology, Inc. (603325.SS) dividend history over the years, including the amount per share, the payout date, and any adjustments for stock splits.
Shanghai Bloom Technology, Inc. (603325.SS) dividend history also allows you to track its dividend growth over time. This gives you insight into how the company’s earnings and payout ratios have evolved. Tracking this growth can help you gauge the stock's potential for future income.
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