603005.SS
Price:
$27.35
Market Cap:
$17.84B
China Wafer Level CSP Co., Ltd. provides wafer level miniaturization technologies and processes for the electronics industry. It offers image sensor, biometric identification, and ambient light sensor chips, as well as medical electronic devices and automotive sensors. The company also provides infrastructure solutions, including design, test, and logistics; design chain management; design for manufacturing; design for cost; full design and verification of WL, leadframe, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services. In addition, it offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manu...[Read more]
Industry
Semiconductors
IPO Date
2014-02-10
Stock Exchange
SHH
Ticker
603005.SS
According to China Wafer Level CSP Co., Ltd.’s latest financial reports and current stock price. The company's current Dividend Yield is 0.31%. This represents a change of 356.37% compared to the average of 0.07% of the last 4 quarters.
The mean historical Dividend Yield of China Wafer Level CSP Co., Ltd. over the last ten years is 0.48%. The current 0.31% Dividend Yield has changed -35.45% with respect to the historical average. Over the past ten years (40 quarters), 603005.SS's Dividend Yield was at its highest in in the June 2022 quarter at 1.02%. The Dividend Yield was at its lowest in in the December 2015 quarter at 0%.
Average
0.48%
Median
0.47%
Minimum
0.16%
Maximum
0.96%
Discovering the peaks and valleys of China Wafer Level CSP Co., Ltd. Dividend Yield, unveiling quarterly and yearly fluctuations to gain insights into the company’s financial performance and market dynamics, offering valuable data for investors and analysts alike.
Maximum Annual Increase = 266.54%
Maximum Annual Dividend Yield = 0.96%
Minimum Annual Increase = -66.10%
Minimum Annual Dividend Yield = 0.16%
| Year | Dividend Yield | Change |
|---|---|---|
| 2024 | 0.19% | -41.55% |
| 2023 | 0.32% | -66.10% |
| 2022 | 0.96% | 58.57% |
| 2021 | 0.60% | 266.54% |
| 2020 | 0.16% | -55.40% |
| 2019 | 0.37% | -54.00% |
| 2018 | 0.80% | 260.81% |
| 2017 | 0.22% | -60.86% |
| 2016 | 0.57% | 0.60% |
| 2015 | 0.56% | -0.13% |
The current Dividend Yield of China Wafer Level CSP Co., Ltd. (603005.SS) is less than than its 3-year, less than than its 5-year, and less than than its 10-year historical averages
3-year avg
0.49%
5-year avg
0.45%
10-year avg
0.48%
China Wafer Level CSP Co., Ltd.’s Dividend Yield is less than Shanghai Awinic Technology Co.,Ltd. (0.46%), less than Grinm Advanced Materials Co., Ltd. (0.55%), less than Shanghai Sinyang Semiconductor Materials Co., Ltd. (0.45%), less than Wuxi Taiji Industry Limited Corporation (1.24%), less than Southchip Semiconductor Technology (0.80%), greater than Sai MicroElectronics Inc. (0%), less than Hunan Goke Microelectronics Co.,Ltd. (0.31%), less than Puya Semiconductor (Shanghai) Co., Ltd. (0.36%), less than Northking Information Technology Co., Ltd. (0.92%), less than SigmaStar Technology Ltd (0.33%),
| Company | Dividend Yield | Market cap |
|---|---|---|
| 0.46% | $16.65B | |
| 0.55% | $16.86B | |
| 0.45% | $17.96B | |
| 1.24% | $16.02B | |
| 0.80% | $16.01B | |
| 0% | $46.41B | |
| 0.31% | $20.58B | |
| 0.36% | $18.36B | |
| 0.92% | $16.65B | |
| 0.33% | $16.42B |
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