3372.TWO
Price:
$18.75
Market Cap:
$3.29B
Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company's products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. Taiwan IC Packaging Corporation was founded in 1998 and is headquartered in Kaohsiung, Taiwan.
Industry
Semiconductors
IPO Date
2007-12-31
Stock Exchange
TWO
Ticker
3372.TWO
According to Taiwan IC Packaging Corporation’s latest financial reports and current stock price. The company's current Dividend Yield is 0%. This represents a change of 0% compared to the average of 0% of the last 4 quarters.
The mean historical Dividend Yield of Taiwan IC Packaging Corporation over the last ten years is 1.41%. The current 0% Dividend Yield has changed -100.00% with respect to the historical average. Over the past ten years (40 quarters), 3372.TWO's Dividend Yield was at its highest in in the September 2022 quarter at 9.50%. The Dividend Yield was at its lowest in in the September 2021 quarter at 0%.
Average
1.41%
Median
0%
Minimum
0%
Maximum
9.20%
Discovering the peaks and valleys of Taiwan IC Packaging Corporation Dividend Yield, unveiling quarterly and yearly fluctuations to gain insights into the company’s financial performance and market dynamics, offering valuable data for investors and analysts alike.
Maximum Annual Increase = 0%
Maximum Annual Dividend Yield = 9.20%
Minimum Annual Increase = 0%
Minimum Annual Dividend Yield = 0%
| Year | Dividend Yield | Change |
|---|---|---|
| 2024 | 0% | -100.00% |
| 2023 | 3.51% | -61.87% |
| 2022 | 9.20% | Infinity% |
| 2021 | 0% | 0% |
| 2020 | 0% | 0% |
| 2019 | 0% | 0% |
| 2018 | 0% | 0% |
| 2017 | 0% | 0% |
The current Dividend Yield of Taiwan IC Packaging Corporation (3372.TWO) is less than than its 3-year, less than than its 5-year, and less than than its 10-year historical averages
3-year avg
4.24%
5-year avg
2.54%
10-year avg
1.41%
Taiwan IC Packaging Corporation’s Dividend Yield is less than Easy Field Corporation (1.07%), less than Tradetool Auto Co., Ltd. (0%), less than C-Media Electronics Inc. (0.61%), less than Rafael Microelectronics, Inc. (1.77%), less than Chip Hope Co., Ltd (0%), less than Potens (4.57%), less than Ultra Chip, Inc. (1.01%), less than Goldkey Technology Corporation (2.11%), less than ALi Corporation (0%), less than JMicron Technology Corp. (0%),
| Company | Dividend Yield | Market cap |
|---|---|---|
| 1.07% | $4.54B | |
| 0% | $3.37B | |
| 0.61% | $3.27B | |
| 1.77% | $3.51B | |
| 0% | $4.14B | |
| 4.57% | $2.85B | |
| 1.01% | $3.77B | |
| 2.11% | $4.84B | |
| 0% | $3.47B | |
| 0% | $2.64B |
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