Taiwan IC Packaging Corporation
3372.TWO
Price:
$13.3
Market Cap:
$2.33B
Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company's products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. Taiwan IC Packaging Corporation was founded in 1998 and is headquartered in Kaohsiung, Taiwan.
Industry
Semiconductors
IPO Date
2007-12-31
Stock Exchange
TWO
Ticker
3372.TWO
PE Ratio
[-12.55]
ROE
[-10.36%]
Current Ratio
[4.34]
Dividend Yield
[0%]
Enterprise Value
[2.08B]
Dividend History
3372.TWO Dividend History Overview
Dividends are a key part of long-term returns for investors, and Taiwan IC Packaging Corporation (3372.TWO) has a track record worth reviewing. Looking at dividend history for 3372.TWO gives you an idea of how consistent the dividends have been and what you might expect in the future.
Ex-Dividend Date
2023-09-07
Dividend Yield
0%
Annual Dividend
$0.50
P/E Ratio
-12.55
Payout Ratio
0
Dividend per Share
$0
EPS
-1.06
| Ex-Date/EFF Date | Dividend Amount | Adjusted Dividend | Payment Date | Declaration Date |
|---|---|---|---|---|
| 2023-09-07 | $0.5002 | $0.5002 | ||
| 2022-09-07 | $0.998 | $0.998 | ||
| 2008-06-11 | $0.9387 | $2.16511 |
Taiwan IC Packaging Corporation (3372.TWO) Dividend History Chart
The table below shows Taiwan IC Packaging Corporation (3372.TWO) dividend history over the years, including the amount per share, the payout date, and any adjustments for stock splits.
Taiwan IC Packaging Corporation (3372.TWO) Dividend Growth
Taiwan IC Packaging Corporation (3372.TWO) dividend history also allows you to track its dividend growth over time. This gives you insight into how the company’s earnings and payout ratios have evolved. Tracking this growth can help you gauge the stock's potential for future income.
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Frequently asked questions❓
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