3189.TW
Price:
$137
Market Cap:
$62.58B
Kinsus Interconnect Technology Corp. manufactures and sells electronic products in Taiwan and internationally. It operates through three segments: IC Substrate, Printed Circuit Board (PCB), and Optics. The company offers system in package, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for modules in handset and wearable devices; plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. It also provides wire bond chip scale package substrate for application processor, connectivity,...[Read more]
Industry
Semiconductors
IPO Date
2004-11-01
Stock Exchange
TAI
Ticker
3189.TW
According to Kinsus Interconnect Technology Corp.’s latest financial reports and current stock price. The company's current Dividend Yield is 0.73%. This represents a change of 36.06% compared to the average of 0.54% of the last 4 quarters.
The mean historical Dividend Yield of Kinsus Interconnect Technology Corp. over the last ten years is 3.77%. The current 0.73% Dividend Yield has changed -80.61% with respect to the historical average. Over the past ten years (40 quarters), 3189.TW's Dividend Yield was at its highest in in the September 2023 quarter at 6.01%. The Dividend Yield was at its lowest in in the December 2015 quarter at 0%.
Average
3.77%
Median
4.15%
Minimum
0.48%
Maximum
7.37%
Discovering the peaks and valleys of Kinsus Interconnect Technology Corp. Dividend Yield, unveiling quarterly and yearly fluctuations to gain insights into the company’s financial performance and market dynamics, offering valuable data for investors and analysts alike.
Maximum Annual Increase = 953.24%
Maximum Annual Dividend Yield = 7.37%
Minimum Annual Increase = -86.54%
Minimum Annual Dividend Yield = 0.48%
| Year | Dividend Yield | Change |
|---|---|---|
| 2024 | 0.99% | -86.54% |
| 2023 | 7.37% | 45.90% |
| 2022 | 5.05% | 953.24% |
| 2021 | 0.48% | -61.16% |
| 2020 | 1.23% | -57.64% |
| 2019 | 2.91% | -15.48% |
| 2018 | 3.45% | -36.80% |
| 2017 | 5.46% | 12.43% |
| 2016 | 4.85% | -17.17% |
| 2015 | 5.86% | 79.49% |
The current Dividend Yield of Kinsus Interconnect Technology Corp. (3189.TW) is less than than its 3-year, less than than its 5-year, and less than than its 10-year historical averages
3-year avg
4.47%
5-year avg
3.02%
10-year avg
3.77%
Kinsus Interconnect Technology Corp.’s Dividend Yield is less than AP Memory Technology Corporation (1.77%), less than Co-Tech Development Corporation (0.60%), less than ADATA Technology Co., Ltd. (2.58%), less than Radiant Opto-Electronics Corporation (8.59%), less than Topco Scientific Co.,Ltd. (3.99%), less than Chunghwa Precision Test Tech. Co., Ltd. (0.33%), greater than Macronix International Co., Ltd. (0%), less than Sigurd Microelectronics Corporation (4.02%), less than Parade Technologies, Ltd. (2.90%), less than WNC Corporation (4.68%),
| Company | Dividend Yield | Market cap |
|---|---|---|
| 1.77% | $64.17B | |
| 0.60% | $62.74B | |
| 2.58% | $62.98B | |
| 8.59% | $56.84B | |
| 3.99% | $57.50B | |
| 0.33% | $78.37B | |
| 0% | $72.39B | |
| 4.02% | $48.50B | |
| 2.90% | $44.34B | |
| 4.68% | $49.62B |
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