2344.TW
Price:
$71.3
Market Cap:
$320.85B
Winbond Electronics Corporation designs, develops, manufactures, and markets very large scale integration integrated circuits (ICs) for various microelectronic applications in Asia, the Americas, Europe, and internationally. It operates through DRAM IC Product, Flash Memory Product, and Logic IC Product segments. The company offers mobile dynamic random access memory (DRAM) devices, including pseudo static random access memory (SRAM), HyperRAM, low power SDR synchronous dynamic random access memory (SDRAM), low power double-data-rate (DDR) SDRAM, and known good die (KGD) products, as well as low power DDR1, DD2, DDR3, and DD4/4X SDRAM products. It also provides specialty DRAM products, such ...[Read more]
Industry
Semiconductors
IPO Date
2000-01-04
Stock Exchange
TAI
Ticker
2344.TW
According to Winbond Electronics Corporation’s latest financial reports and current stock price. The company's current Dividend Yield is 0%. This represents a change of 0% compared to the average of 0% of the last 4 quarters.
The mean historical Dividend Yield of Winbond Electronics Corporation over the last ten years is 2.61%. The current 0% Dividend Yield has changed -100.00% with respect to the historical average. Over the past ten years (40 quarters), 2344.TW's Dividend Yield was at its highest in in the September 2018 quarter at 6.87%. The Dividend Yield was at its lowest in in the December 2015 quarter at 0%.
Average
2.61%
Median
1.78%
Minimum
0%
Maximum
7.66%
Discovering the peaks and valleys of Winbond Electronics Corporation Dividend Yield, unveiling quarterly and yearly fluctuations to gain insights into the company’s financial performance and market dynamics, offering valuable data for investors and analysts alike.
Maximum Annual Increase = 767.24%
Maximum Annual Dividend Yield = 7.66%
Minimum Annual Increase = -100.00%
Minimum Annual Dividend Yield = 0%
| Year | Dividend Yield | Change |
|---|---|---|
| 2024 | 0% | -100.00% |
| 2023 | 3.37% | -34.23% |
| 2022 | 5.13% | 767.24% |
| 2021 | 0.59% | 70.93% |
| 2020 | 0.35% | -93.27% |
| 2019 | 5.14% | -32.81% |
| 2018 | 7.66% | 203.09% |
| 2017 | 2.53% | 145.05% |
| 2016 | 1.03% | 198.12% |
| 2015 | 0.35% | 39.34% |
The current Dividend Yield of Winbond Electronics Corporation (2344.TW) is less than than its 3-year, less than than its 5-year, and less than than its 10-year historical averages
3-year avg
2.84%
5-year avg
1.89%
10-year avg
2.61%
Winbond Electronics Corporation’s Dividend Yield is less than Realtek Semiconductor Corp. (5.13%), less than King Yuan Electronics Co., Ltd. (1.86%), less than Novatek Microelectronics Corp. (7.45%), less than GlobalWafers Co., Ltd. (2.93%), less than Alchip Technologies, Limited (1.14%), less than Global Unichip Corp. (0.78%), less than ASPEED Technology Inc. (0.79%), less than Advantech Co., Ltd. (2.97%), less than Vanguard International Semiconductor Corporation (4.67%), less than Phison Electronics Corp. (1.64%),
| Company | Dividend Yield | Market cap |
|---|---|---|
| 5.13% | $254.89B | |
| 1.86% | $263.50B | |
| 7.45% | $228.80B | |
| 2.93% | $179.77B | |
| 1.14% | $260.46B | |
| 0.78% | $274.05B | |
| 0.79% | $248.69B | |
| 2.97% | $244.08B | |
| 4.67% | $175.70B | |
| 1.64% | $229.03B |
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